512 Mbit NOR flash in a 24-BGA footprint
The S25FS512SDSBHV213: Housed in a 24-TBGA (8x6 mm) package, this is a surface-mount BGA — the 0.80 mm ball pitch demands a controlled impedance PCB stack-up and X-ray inspection for solder joint integrity after reflow. The tape-and-reel and cut-tape packaging options let a prototype run or a production reel share the same BOM line.
Active production, no end-of-life watch
ROHS3 compliant.
Peer comparison — S25FS512SAGNFI011
For a design that needs the full 105°C ambient, the S25FS512SDSBHV213 is the correct temperature bin.
