Skip to main content
Infineon Technologies S25FS512SAGNFB010 — Discrete Semiconductors

S25FS512SAGNFB010 NOR Flash 512Mbit SPI Quad I/O, AEC-Q100

MPNS25FS512SAGNFB010
End of Life

Infineon (Cypress) S25FS512SAGNFB010, Automotive AEC-Q100 FS-S series, 512Mbit NOR Flash, SPI Quad I/O QPI, 133 MHz, 1.7V–2V supply, -40°C to +105°C, 8-WSON (6x8 mm) tray.

$11.34Ref. price · indicative, final on quote
Packaging8-WDFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

S25FS512SAGNFB010 Technical Specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FS-S
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage1.7V ~ 2V
Frequency133 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C ~ 105°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size512Mbit
Memory formatFLASH
Case8-WDFN Exposed Pad
Memory organization64M x 8

Product details

512 Mbit NOR Flash for automotive and industrial — what it is and where it fits

The S25FS512SAGNFB010 is a 512 Mbit NOR Flash memory from Infineon's FS-S series, qualified to AEC-Q100 for automotive applications. It uses a 1.7 V to 2 V supply rail and communicates over SPI with Quad I/O and QPI support, clocking up to 133 MHz. The memory is organized as 64 M x 8 bits and comes in an 8-WSON package with an exposed pad (6 x 8 mm) for thermal management. This part is built for non-volatile code and data storage in engine control units, ADAS modules, telematics, and other under-hood or cabin electronics where the -40°C to +105°C temperature range covers the full automotive environment.

Package and mounting — 8-WSON with exposed pad

The 8-WSON (6 x 8 mm) package has an exposed pad on the bottom. That pad must be soldered to a thermal land on the PCB — it is the primary heat path and also ties to the substrate ground. The part is surface-mount only; no through-hole option exists. For hand-prototyping, a hot-air rework station with a fine nozzle works; a standard soldering iron will struggle with the pad. If you need a tube-packaged variant with a lower temperature grade (85°C), the S25FS512SAGNFI011 is the same die in the same package but rated to 85°C.

Frequently asked questions

Is S25FS512SAGNFB010 AEC-Q100 qualified?

Yes, the S25FS512SAGNFB010 is part of the Automotive, AEC-Q100 FS-S series, qualified for automotive-grade applications.

Does S25FS512SAGNFB010 support Quad SPI?

Yes, it supports SPI with Quad I/O and QPI (Quad Peripheral Interface) modes, allowing four data lines for higher throughput.