128 Mbit SPI NOR Flash for firmware storage
The S25FS128SAGBHI200: It uses a Quad I/O and QPI interface, clocked at 133 MHz, which gives the firmware engineer a fast read path for code shadowing or execute-in-place (XIP) from the NOR array. The 1.7V to 2V supply rail places this part in the low-voltage domain, common in battery-powered or power-constrained embedded systems where the core logic runs at 1.8V nominal.
Package and board integration
Housed in a 24-ball TBGA (8x6 mm body), the S25FS128SAGBHI200 requires a surface-mount reflow profile typical for BGA packages. The 0.80 mm ball pitch is manageable on a standard 4-layer PCB with via-in-pad if the layout engineer plans the fan-out under the device. The tray packaging means the parts arrive in a rigid carrier — store the reels dry if the MSL rating (not stated in this record) calls for it; BGA packages commonly ship at MSL 3 or higher.
Note the RoHS compliance status: the record shows RoHS non-compliant. This may indicate a lead-bearing solder ball finish or an exemption. Confirm the exact termination finish against the latest Infineon material declaration before committing to a RoHS-required BOM.