The S25FS064SDSBHV020: At an 80 MHz clock, Quad I/O delivers effective data rates up to 320 Mbps — enough to support execute-in-place (XIP) code shadowing for many MCUs without a separate parallel bus.
Lifecycle — still a current-production part
No successor has been announced, and the FS-S series remains a standard offering for new designs. For a procurement planner, this means the part can be qualified into a BOM without worrying about an imminent EOL notice.
Package and mounting — 24-ball BGA
Supplied in a 24-ball BGA package for surface-mount assembly. The BGA footprint saves board area compared to an SOIC or WSON, but it does require X-ray inspection for solder-joint verification after reflow. MSL level is not in the record, so assume MSL 3 as a default for a plastic BGA — bake before reflow if the moisture-barrier bag has been open past the floor-life window.
