S25FL512SDSMFB010

Infineon Technologies · Automotive, AEC-Q100, FL-S Series

Infineon S25FL512SDSMFB010, Automotive AEC-Q100 FL-S series, 512Mbit NOR Flash, SPI/Quad I/O interface, 80 MHz clock, 2.7V–3.6V supply, -40°C to 105°C, 16-SOIC package.

Infineon Technologies S25FL512SDSMFB010
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$31.43/ pc

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MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

S25FL512SDSMFB010 specifications
Parameter / AttributeSpecification / Value
SeriesAutomotive, AEC-Q100, FL-S
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency80 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 105°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size512Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization64M x 8

Technical details

The S25FL512SDSMFB010: The 512 Mbit density suits firmware images with OTA staging, parameter tables, and boot code in a single chip. Quad I/O at 80 MHz delivers enough read throughput to support execute-in-place (XIP) for many real-time control loops without a separate DRAM.

80 MHz clock — timing margin in the SPI bus

At 80 MHz the SPI clock period is 12.5 ns. With Quad I/O, each clock edge transfers four bits, so the sustained read rate reaches about 40 MB/s. The 16-SOIC wide-body package keeps trace inductance low, but the layout should keep the SPI clock line unterminated runs under 50 mm to avoid reflections at this edge rate.

Package and rework — 16-SOIC wide body

The 16-SOIC (0.295", 7.50 mm width) is a standard wide-body SOIC footprint. It is hand-solderable and rework-friendly.

The AEC-Q100 qualification and ROHS3 compliance are current.

S25FL512SDSMFB010
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