Active production — 512 Mbit NOR flash for code-shadowing and data-logging
Infineon still actively produces the S25FL512SDPBHIC13 under the FL-S series, so there is no EOL-driven BOM churn for current designs. The 512 Mbit density organized as 64M x 8 gives enough headroom for a full firmware image plus a file-system partition in a single package.
Industrial temperature grade and 24-ball BGA integration
The 24-ball BGA (8x6 mm body) uses a 0.80 mm ball pitch — a four-layer PCB with via-in-pad or microvia fan-out handles the routing cleanly. The 24-BGA footprint is shared across the FL-S family at this density, so a single board layout can accept the 256 Mbit or 1 Gbit sibling without a respin. The Tape & Reel packaging (TR) means the part feeds into standard pick-and-place lines; no special handling beyond the usual BGA moisture bake if the MSL floor is exceeded.
Sourcing posture — active, quoted to order
Infineon lists the product status as Active, meaning the die bank and assembly are running.