It uses a SPI Quad I/O interface that supports read speeds up to 66 MHz, which translates to a practical throughput of roughly 33 MB/s in quad-read mode — enough to shadow a firmware image into SRAM or support execute-in-place for a bootloader.
There is no NRND flag, no announced EOL, and no last-time-buy window to track. The base product number S25FL512 covers multiple speed and package variants; the SDPBHI310 suffix identifies the 24-BGA (8x6 mm) package and industrial temperature range.
24-BGA footprint and supply rails
The 24-ball BGA (8x6 mm) is a compact footprint for a 512 Mbit part — roughly the same board area as a 16-pin SOIC but with a finer ball pitch. No separate VPP pin is needed for programming; the core and I/O share the same supply. The Tray shipping medium is typical for BGA devices; if your pick-and-place prefers tape, check the reel-pack variant (S25FL512SDPBHI313 or similar) at quote time.
