Skip to main content
Infineon Technologies S25FL512SDPBHB213 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL512SDPBHB213 512 Mbit NOR Flash, 66 MHz SPI, AEC-Q100

MPNS25FL512SDPBHB213
Active

Infineon/Cypress S25FL512SDPBHB213, Automotive AEC-Q100 FL-S series, 512 Mbit NOR Flash, SPI Quad I/O, 66 MHz, 2.7V-3.6V, -40°C to 105°C, 24-BGA (8x6), Tape & Reel.

$10.5875Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL512SDPBHB213 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency66 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~105°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size512Mbit
Memory formatFLASH
Case24-TBGA
Memory organization64M x 8

Product details

Quad I/O SPI at 66 MHz — read throughput for firmware and data logging

The Quad I/O interface allows four data lines to operate simultaneously, quadrupling the effective read throughput compared to a standard single-bit SPI at the same clock. At 66 MHz, the device can sustain around 33 MB/s sequential reads — enough for fast boot loading or OTA staging in an automotive ECU. The 512 Mbit density provides 64 MB of storage, which can hold multiple firmware images, calibration tables, and a file system for data logging.

The AEC-Q100 qualification also simplifies qualification for Tier-1 automotive customers.

Package and mounting — 24-BGA with Tape & Reel delivery

The 24-BGA (8x6 mm) package is a fine-pitch ball-grid array, requiring standard SMT assembly with a reflow profile compatible with lead-free solders. The Tape & Reel (TR) packaging option is intended for automated pick-and-place lines; each reel contains a known quantity for kitting. The surface-mount footprint is compact, saving board area compared to SOIC or TSOP alternatives.