512 Mbit NOR flash, 133 MHz SPI Quad I/O
The S25FL512SAGBHV210: Housed in a 24-ball TBGA package measuring 8x6 mm, the footprint is compact but requires careful BGA fan-out on the PCB — the 0.80 mm ball pitch is manageable on a standard 4-layer board if the escape routing is planned for the inner rows. The industrial temperature grade (-40°C to +105°C) covers the full operating envelope for motor drives, outdoor telecom, and under-hood automotive-adjacent systems, though it is not AEC-Q100 qualified.
Sourced through independent distribution channels.
Peer comparison: temperature grade and package variants
Three peers share the same 512 Mbit FL-S die and 133 MHz Quad I/O interface: S25FL512SAGMFIR10, S25FL512SAGMFIG10, and S25FL512SAGMFI010. They also use a 16-pin SOIC-W (300 mil) package instead of the 24-TBGA — a larger, easier-to-inspect footprint but one that takes more board area. The SOIC peers are better suited for hand-assembly or rework-heavy environments where a BGA's hidden solder joints are a risk.