Skip to main content
Infineon Technologies S25FL512SAGBHAC13 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL512SAGBHAC13 NOR Flash, 512 Mbit, 133 MHz, AEC-Q100

MPNS25FL512SAGBHAC13
Active

Infineon S25FL512SAGBHAC13, Automotive AEC-Q100 FL-S series, 512 Mbit NOR Flash, SPI - Quad I/O, 133 MHz, 2.7V-3.6V, -40°C to 85°C, 24-TBGA (8x6 mm).

$7.3028Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL512SAGBHAC13 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size512Mbit
Memory formatFLASH
Case24-TBGA
Memory organization64M x 8

Product details

Automotive-grade NOR Flash for code shadowing and data logging

It uses a Quad SPI interface running at 133 MHz, which gives you fast read throughput for firmware shadowing or XIP (eXecute In Place) in an automotive ECU, ADAS module, or telematics unit.

The 133 MHz clock on the Quad-SPI interface translates to a theoretical read throughput of 532 Mbps (four data lines at 133 MHz). In practice, with command overhead and dummy cycles, you can expect around 50-70 MB/s sustained reads — enough to feed a high-end Cortex-R or Cortex-M core without stalling. The 64M x 8 organization (512 Mbit) means the memory array is byte-addressable, which simplifies firmware partitioning: one large code region or multiple smaller data logs.

AEC-Q100 qualification is not just a sticker — it means the part has passed a suite of reliability tests: high-temperature operating life (HTOL), temperature cycling, moisture sensitivity, and electrostatic discharge (HBM/CDM). For a production BOM in an automotive ECU, this qualification is often a gate requirement. The FL-S series is Infineon's mainstream automotive NOR Flash line, so you get a known track record and PCN/EOL support. The active lifecycle status means no near-term obsolescence risk — you can design it in without worrying about a last-time-buy window.

24-ball BGA footprint — layout notes

That is a standard, easy-to-route BGA — no micro-vias needed for most designs. The supplier device package is 24-BGA (8x6), so the footprint is consistent across the FL-S family. For decoupling, a 100 nF ceramic cap per supply pin pair, placed as close to the balls as the via pattern allows, keeps the supply clean at 133 MHz.

Frequently asked questions

What is the closest pin-compatible alternative to the S25FL512SAGBHAC13?

For a direct drop-in with the same temperature grade, the S25FL512SAGBHAC13 itself is the standard choice.