256 Mbit NOR Flash with Quad-I/O throughput
The S25FL256SDPBHIC10: This density suits firmware images, boot code, and parameter storage for embedded systems that need fast read performance without the erase overhead of NAND.
The 24-BGA package (8x6 mm body) keeps the footprint compact — the 0.80 mm ball pitch routes through two inner layers on a standard 4-layer PCB without microvias. Tray packaging means the parts arrive in antistatic trays, not tape-and-reel, which is the norm for prototyping and low-volume production runs.
Active lifecycle and sourcing posture
Sourced through authorized and independent distribution; pricing and lead time confirmed per RFQ against your target quantity.