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Infineon Technologies S25FL256SAGMFIR00 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL256SAGMFIR00 FL-S NOR Flash, 256Mbit, 133 MHz

MPNS25FL256SAGMFIR00
Active

Infineon FL-S series NOR Flash memory, S25FL256SAGMFIR00, 256 Mbit, SPI Quad I/O, 133 MHz, 16-SOIC wide-body (7.50 mm), Tray, -40 to +85 °C.

$5.8400Ref. price · indicative, final on quote
Packaging16-SOIC (0.295", 7.50mm Width)
RoHSROHS3 Compliant
SeriesFL-S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256SAGMFIR00 specifications
ParameterValue
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization32M x 8

Product details

256 Mbit NOR flash for firmware and parameter storage

The Infineon S25FL256SAGMFIR00 is a 256 Mbit FL-S series NOR flash organized as 32M x 8 bits, accessed over an SPI bus with Quad I/O support at up to 133 MHz. The 133 MHz clock rate with Quad I/O yields a sustained read throughput that keeps a Cortex-M or RISC-V core fed during XIP (eXecute-In-Place) operation — the limiting factor is the flash array access time, not the bus itself. The 2.7 V to 3.6 V supply range matches the common 3.3 V I/O rail on most MCUs and SoCs, but the lower end at 2.7 V means it can ride through a brown-out condition on a 3.3 V rail without losing data integrity — the read path remains valid down to the minimum operating voltage.

Package footprint and PCB integration

Housed in a 16-SOIC wide-body package (7.50 mm body width), this flash uses the standard JEDEC SOIC-16W footprint — the 1.27 mm pin pitch is hand-solderable and routes easily on a two-layer board, unlike fine-pitch BGA or QFN alternatives that require micro-vias. The wide-body package also dissipates heat better than the narrow SOIC variant under sustained read bursts. The industrial temperature rating of -40°C to +85°C covers the majority of factory-floor, outdoor telecom, and automotive cabin applications. For engine-bay or under-hood duty where ambient exceeds 85°C, the S25FL256SAGMFV000 or S25FL256SAGMFVG00 siblings extend the range to 105°C while keeping the same pinout and command set — a drop-in swap on the same PCB layout.

Active lifecycle and procurement posture

The S25FL256SAGMFIR00 carries an active lifecycle status from Infineon — no last-time-buy or end-of-life notice is in effect, so it remains suitable for both new designs and ongoing production builds. ROHS3 compliance means no substance exemptions to track for EU or UKCA markets. No stock-holding claim is made; the part is quoted to order per the BOM quantity.

Frequently asked questions

Will S25FL256SAGMFIR00 drop into a board designed for S25FL256SAGMFV000 without rewiring?

Yes — both parts share the same 16-SOIC wide-body package, the same 133 MHz Quad I/O SPI interface, the same 2.7 V to 3.6 V supply range, and the same 32M x 8 memory organization. The only parametric difference is the temperature grade: the MFIR00 is rated -40°C to +85°C, while the MFV000 extends to -40°C to +105°C. A board laid out for one accepts the other as a drop-in replacement.

What compliance documentation does Infineon provide for S25FL256SAGMFIR00?

Infineon certifies the S25FL256SAGMFIR00 as ROHS3 Compliant per the current EU RoHS directive, covering all ten restricted substances plus the four phthalates. No exemption declarations are needed for this order code. Standard Infineon material declaration and REACH SVHC disclosure are available through the manufacturer's compliance portal.