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Infineon Technologies S25FL256SAGMFB010 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL256SAGMFB010 Infineon 256Mbit SPI NOR Flash, 133 MHz

MPNS25FL256SAGMFB010
Active

Infineon Technologies FL-S series Automotive, AEC-Q100 NOR Flash, 256 Mbit, SPI Quad I/O, 133 MHz, 2.7-3.6 V, -40 to 105 °C, 16-SOIC, Tray.

$8.8500Ref. price · indicative, final on quote
Packaging16-SOIC (0.295", 7.50mm Width)
RoHSROHS3 Compliant
SeriesAutomotive, AEC-Q100, FL-S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256SAGMFB010 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 105°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization32M x 8

Product details

256 Mbit NOR flash, 133 MHz quad-I/O, AEC-Q100

The Infineon S25FL256SAGMFB010 is a 256 Mbit SPI NOR flash from the FL-S series, organised as 32M x 8 bits and clocked at 133 MHz over a Quad I/O interface. That clock rate means a single quad-read burst can push data at roughly 66 MB/s — enough to feed a Cortex-M7 executing from XIP without wait-state bottlenecks at moderate core speeds. It is qualified to AEC-Q100 Grade 2, which means the die and package have passed the full automotive reliability stress battery: high-temperature operating life, temperature cycling, ESD, and latch-up. The -40 to 105 °C operating range covers under-hood and cabin electronics in passenger vehicles and commercial trucks.

Active production, ROHS3, no successor needed

ROHS3 compliant and the FL-S series is Infineon's mainstream automotive NOR flash family.

Board-fit and footprint notes

The 16-SOIC wide-body package (7.50 mm body width, 0.295-inch pitch) is a standard JEDEC outline. The land pattern matches the footprint used by other 256 Mbit SPI NOR parts in the same package — if your layout already has a 16-SOICW footprint for a different vendor's flash, this part drops in without a board spin. The tray packaging means the parts arrive in anti-static trays, not tape-and-reel — factor that into your pick-and-place feeder setup if you are running a reel-only line.

Frequently asked questions

Will S25FL256SAGMFB010 drop into a board designed for S25FL256SAGMFV000?

Both parts share the same 256 Mbit FL-S family, 133 MHz Quad I/O interface, and 16-SOIC package. The S25FL256SAGMFV000 is a functional peer with identical memory organisation and supply voltage. The main difference is the suffix — the FB010 variant is the tray-packaged, automotive-temperature-grade version. Footprint and pinout are the same, so it is a drop-in replacement for the same BOM position.

What compliance documentation does Infineon provide for this part?

The part is ROHS3 compliant. Infineon typically provides a Certificate of Compliance (CoC) and material declaration upon request through the distribution channel.