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Infineon Technologies S25FL256SAGBHVA03 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL256SAGBHVA03 256 Mbit NOR Flash

MPNS25FL256SAGBHVA03
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Infineon FL-S series, S25FL256SAGBHVA03, 256 Mbit NOR Flash, SPI - Quad I/O, 133 MHz clock, 2.7V-3.6V supply, -40°C to 105°C, 24-TBGA package.

$5.0050Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256SAGBHVA03 specifications
ParameterValue
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~105°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Product details

256 Mbit NOR Flash with Quad-SPI — what it brings to the board

The Infineon S25FL256SAGBHVA03 is a 256 Mbit FL-S series NOR Flash memory organized as 32M x 8 bits. The memory is non-volatile, formatted as FLASH, and comes in a 24-TBGA surface-mount package (24-BGA, 8x6 mm).

133 MHz Quad-SPI — throughput for XIP and fast boot

The 133 MHz clock frequency on the Quad I/O interface delivers a theoretical read throughput of 532 Mbps (133 MHz x 4 data lines). That is enough to support execute-in-place (XIP) from Flash for many MCUs and SoCs, eliminating the need to shadow code into RAM. For firmware updates, the Quad-SPI bus reduces the time to write a 32 MB image compared to standard SPI. The interface is backward-compatible with standard SPI, so it drops into existing SPI controllers that support Quad mode.

The 105°C ceiling is above the typical 85°C industrial limit, giving headroom for designs that run hot or sit near a power stage. Storage temperature exceeds this range, but the operating spec is what governs reliability under load.

The FL-S series has broad industry adoption, so supply continuity through independent distribution is stable. If you are qualifying this for a new design, there is no lifecycle-driven urgency to find a second source today.

Package and footprint — 24-BGA (8x6 mm)

The 24-TBGA package measures 8 mm x 6 mm (body), with a 0.8 mm ball pitch typical for this density. It is a surface-mount BGA that requires a solder-paste stencil and reflow profile per the manufacturer's recommendations.

Frequently asked questions

Is S25FL256SAGBHVA03 compatible with standard SPI interfaces?

Yes. The SPI - Quad I/O interface is backward-compatible with standard SPI. It also supports Dual SPI and Quad SPI protocols, so it works with any SPI master that can drive the protocol. The 133 MHz clock rate is the maximum; the part will operate at lower frequencies as well.

What is the closest pin-compatible alternative to S25FL256SAGBHVA03 in this component family?

Within the FL-S series, the S25FL256SAGBHV203 is a close sibling. The primary difference is the package or temperature grade variant. Verify the exact suffix against your BOM to confirm pin compatibility and operating range before substituting.