Package and board-fit for 24-BGA
The S25FL256SAGBHV200: Supplied in a 24-ball TBGA package measuring 8 mm x 6 mm, the device is surface-mount and delivered in tray format. The 0.80 mm ball pitch and 8x6 mm body fit standard BGA layout rules; the supplier device package is 24-BGA (8x6).
Active lifecycle and compliance status
The base product number is S25FL256; the full ordering code includes the package and temperature suffix.
