The S25FL256SAGBHID13: It uses an SPI Quad I/O interface running at 133 MHz, which gives you fast read throughput for code shadowing, firmware storage, and data logging without the pin count of a parallel NOR.
At 133 MHz the Quad-SPI interface delivers a sustained read rate that keeps a Cortex-M or RISC-V core fed during execute-in-place (XIP) boot, provided the host controller's QSPI peripheral can match the clock. The 256 Mbit density gives you room for a bootloader, application image, and a small file system in one device. The 24-ball BGA (6x8 mm) footprint is compact enough for space-constrained PCBs, but the BGA means you need a clean reflow profile and X-ray inspection after assembly — no hand-soldering this one.
For a production BOM, this part does not force a near-term requalification cycle.