256 Mbit SPI Quad I/O NOR flash at 133 MHz
The S25FL256SAGBHIC03: This combination delivers the read throughput needed for execute-in-place (XIP) code shadowing or high-speed firmware updates from a serial bus.
24-BGA footprint and operating envelope
Housed in a 24-ball TBGA (8x6 mm body), the part mounts on the board with a standard surface-mount process — the 0.80 mm ball pitch requires a 4-layer PCB for fan-out of the SPI signals and supply rails. The industrial temperature grade (-40 to +85 °C ambient) suits outdoor telecom, motor-drive control, and automotive cabin electronics where the enclosure sees thermal cycling.
