Skip to main content
Infineon Technologies S25FL256SAGBHIB03 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL256SAGBHIB03 256 Mbit NOR Flash, 133 MHz Quad-SPI

MPNS25FL256SAGBHIB03
Active

Cypress FL-S series, S25FL256SAGBHIB03, 256 Mbit NOR Flash, SPI - Quad I/O, 133 MHz clock frequency, 2.7V to 3.6V supply, -40°C to 85°C operating temperature, 24-BGA (6x8) package.

$4.5850Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256SAGBHIB03 specifications
ParameterValue
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Product details

256 Mbit NOR Flash with Quad-SPI at 133 MHz

It communicates over a SPI interface with Quad I/O support, clocked at 133 MHz. That clock rate, combined with the Quad I/O mode, delivers a sustained read throughput that keeps a Cortex-M or RISC-V core fed for execute-in-place (XIP) code shadowing without wait-state bottlenecks.

Quad I/O read performance – what the 133 MHz clock buys

At 133 MHz in Quad I/O mode, the S25FL256SAGBHIB03 can deliver around 66 MB/s sustained read throughput (133 MHz × 4 bits per cycle). That is enough to support real-time audio buffers, display frame buffers, or OTA staging without external DRAM. The SPI bus also keeps pin count low — only six signals (CLK, CS, IO0–IO3) — which simplifies layout on dense PCBs.

The FL-S series has broad second-source overlap with other Quad-SPI NOR parts, but the active status means you are not forced to exercise that option yet.

24-BGA footprint – layout notes

Housed in a 24-ball BGA measuring 6 mm x 8 mm (ball pitch 0.8 mm), this package fits on a two-layer board if the escape routing uses via-in-pad or dogbone fanout. The 0.8 mm pitch is manageable with standard PCB fabrication tolerances. Decoupling: a 100 nF ceramic within 2 mm of each supply ball pair, plus a 4.7 µF bulk cap near the BGA cluster, keeps the supply clean during page-program bursts.

Frequently asked questions

S25FL256SAGBHIB03 vs S25FL128SAGBHI – what are the differences?

The S25FL256SAGBHIB03 is a 256 Mbit device, while the S25FL128SAGBHI is a 128 Mbit part. Both belong to the FL-S series, share the same Quad-SPI interface, 133 MHz clock, and 24-BGA package. The density difference is the only parametric distinction — the 256 Mbit part doubles the storage for the same footprint and pinout.