S25FL256SAGBHIA13

Infineon Technologies

Cypress FL-S series NOR Flash, S25FL256SAGBHIA13, 256 Mbit, SPI - Quad I/O, 133 MHz, 2.7V~3.6V, -40°C~85°C, 24-TBGA, Tape & Reel.

Infineon Technologies S25FL256SAGBHIA13
[IN STOCK] In Stock: 1 pcs
$11.78/ pc

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MOQ 1 · Tape & Reel (TR) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

S25FL256SAGBHIA13 specifications
Parameter / AttributeSpecification / Value
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Technical details

The Cypress S25FL256SAGBHIA13 is a 256 Mbit serial NOR Flash memory from the FL-S family, organized as 32M x 8 bits. The 133 MHz clock frequency gives a theoretical Quad read throughput of 532 Mbps, which is the figure that matters when sizing the code shadowing time or the data-logging bandwidth in an embedded system. It comes in a 24-ball TBGA package measuring 8 mm x 6 mm — a compact footprint that saves board area but requires BGA assembly and X-ray inspection.

The FL-S series is a mature, widely used NOR Flash family, so supply is stable through both authorized and independent channels.

Quad I/O at 133 MHz — why the interface speed matters

The SPI Quad I/O interface is the main performance differentiator. Standard SPI uses one data line; Quad I/O uses four, quadrupling the read throughput at the same clock rate. At 133 MHz, the Quad read data rate is about 66 MB/s (133 MHz × 4 bits / 8). That is fast enough to support execute-in-place (XIP) from the Flash for many MCUs, eliminating the need to copy code to RAM at boot. For data-logging applications, it means the memory can keep up with high-rate sensor streams without bottlenecking the bus. The interface also supports legacy SPI modes (single, dual) for backward compatibility with controllers that do not have a Quad SPI peripheral.

24-BGA package — what it means for assembly and rework

The 24-ball TBGA (thin BGA) package with an 8 mm x 6 mm body is a space-saving choice, but it commits the board to BGA assembly. The package is surface-mount only, so rework requires a hot-air station with a BGA nozzle and X-ray inspection to verify solder joint integrity.

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