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Infineon Technologies S25FL256SAGBHIA10 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL256SAGBHIA10 256Mbit SPI NOR Flash, 133MHz

MPNS25FL256SAGBHIA10
Active

Infineon FL-S series SPI NOR flash memory, 256Mbit, 133 MHz quad-I/O, 2.7-3.6V supply, -40°C to 85°C industrial temp, 24-TBGA package, tray.

$5.3100Ref. price · indicative, final on quote
Packaging24-TBGA
RoHSROHS3 Compliant
SeriesFL-S
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256SAGBHIA10 specifications
ParameterValue
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Product details

256Mbit SPI NOR flash at 133 MHz — firmware storage and boot-read

The S25FL256SAGBHIA10 is a 256Mbit SPI NOR flash from Infineon's FL-S series, organized as 32M x 8 bits. It supports SPI and Quad I/O interfaces at a clock frequency of 133 MHz, which translates to a sustained read throughput that can keep a Cortex-M or RISC-V core fed during execute-in-place (XIP) boot without wait-state bottlenecks.

BGA footprint — rework station required

The 24-BGA (8x6) supplier package means the ball array is on a 0.8 mm pitch typical for this density. A hot-air reflow station with a preheat plate is the minimum for removal; a profile-matched stencil and paste printer are needed for production rework. The tray packaging is the standard delivery format for BGA parts — no tape-and-reel, so pick-and-place lines need a tray feeder or a tube-to-tape conversion step.