Housed in a 24-ball BGA (8x6 mm body), the S25FL256SAGBHI210 occupies minimal PCB real estate. The 0.80 mm ball pitch is routable on a standard 4-layer board with via-in-pad if the assembly process supports it. The supply decoupling should follow the layout guidelines in the datasheet — typically a 100 nF ceramic placed within 2 mm of each VDD ball pair.
Active lifecycle and sourcing posture
Infineon lists the S25FL256SAGBHI210 as Active.
