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Infineon Technologies S25FL256LDPBHV023 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL256LDPBHV023 256 Mbit NOR Flash, SPI Quad I/O, 66 MHz

MPNS25FL256LDPBHV023
Active

Cypress FL-L series S25FL256LDPBHV023, 256 Mbit NOR Flash, SPI Quad I/O, QPI, 66 MHz clock, 2.7V-3.6V supply, -40°C to 105°C, 24-TBGA (8x6 mm).

$5.3200Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256LDPBHV023 specifications
ParameterValue
SeriesFL-L
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency66 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C~105°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Product details

It uses a SPI interface with Quad I/O and QPI support, clocked at 66 MHz, which gives enough throughput to shadow boot code or stream sensor logs without stalling the host controller. NOR Flash is preferred for execute-in-place (XIP) and reliable code storage because of its fast random-read access and high endurance compared to NAND. The 256 Mbit density fits applications needing a single-chip firmware image plus a config or logging partition — common in industrial controllers, base stations, and automotive telematics units.

The 105°C ceiling means no derating needed for equipment installed near a motor or in a sealed outdoor cabinet that sees solar loading.

Package: 24-TBGA (8x6 mm) — compact footprint for space-constrained boards

The 24-ball BGA package (8 mm x 6 mm body) saves board area versus a traditional SOIC or TSOP. It is surface-mount, so it flows through standard reflow without manual handling. The small footprint is a good fit for multi-layer PCBs where the NOR Flash sits alongside the main SoC or MCU on a tight layout.

Active lifecycle — no last-time-buy risk for production builds

The FL-L series is a mature, widely socketed NOR Flash family with multiple density options sharing the same footprint.