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Infineon Technologies S25FL256LAGMFB001 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL256LAGMFB001 Automotive NOR Flash, 256Mbit, 133 MHz

MPNS25FL256LAGMFB001
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Infineon S25FL256LAGMFB001, Automotive AEC-Q100 FL-L Series, NOR Flash, 256Mbit (32M x 8), SPI Quad I/O, 133 MHz, 2.7V–3.6V, -40°C to 105°C, 16-SOIC.

$5.2575Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256LAGMFB001 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-L
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C ~ 105°C (TA)
PackageTube
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization32M x 8

Product details

256 Mbit automotive NOR Flash in a 16-SOIC footprint

It uses the SPI protocol with Quad I/O and QPI support, clocked at 133 MHz, and is organized as 32M x 8 bits.

133 MHz Quad SPI — read throughput for fast boot and OTA

The 133 MHz clock frequency on the Quad I/O interface delivers a sustained read throughput that keeps the host processor fed during code shadowing or over-the-air update staging. The Quad I/O and QPI modes reduce the pin count to four data lines, which simplifies board routing compared to a parallel NOR interface. For the firmware engineer, this means the Flash can serve as execute-in-place (XIP) memory with minimal wait states at the rated clock.

The AEC-Q100 automotive grade is the key differentiator for this part. For a procurement buyer, this qualification also simplifies the PPAP submission process because the part carries the required automotive certification from Infineon.

There is no end-of-life notification or last-time-buy window to manage. The base product number S25FL256 covers a family of density and package variants, so if a different footprint or temperature grade is needed later, the migration stays within the same qualification envelope.

Package and mounting: 16-SOIC wide-body

No exposed thermal pad — the package relies on the leadframe for heat conduction, so the board layout should include adequate copper pour on the SOIC footprint for thermal relief.

Frequently asked questions

Is S25FL256LAGMFB001 automotive qualified?

Yes, it is listed as Automotive, AEC-Q100 qualified.

What is a direct replacement or equivalent for S25FL256LAGMFB001?

Within the S25FL256 family (base product number), there are variants with different package options and temperature grades. For a pin-compatible alternative in the same 16-SOIC footprint, look at the S25FL256LAGMFB000 or S25FL256LAGMFB010 — the suffix difference typically indicates shipping medium (tape vs tube). All share the same 256 Mbit density, 133 MHz Quad SPI interface, and AEC-Q100 qualification.