The S25FL256LAGBHV023: It communicates over a SPI bus with Quad I/O and QPI support, clocked at 133 MHz. That clock rate, combined with the quad data lines, gives a sustained read throughput that keeps a Cortex-M or RISC-V core fed for execute-in-place (XIP) code without wait-state penalties — the bottleneck shifts from the flash interface to the bus arbitration. Packaged in a 24-ball TBGA (8x6 mm body), this is a surface-mount BGA footprint. The small ball pitch demands careful PCB layout — via-in-pad or microvia fanout is typical for routing the eight signals plus power and ground. The Tape & Reel (TR) shipping format suits automated pick-and-place for volume production.
That means Infineon continues to manufacture it with no announced last-time-buy or end-of-life schedule.
Package and footprint — BGA routing notes
The 24-BGA (8x6 mm) package uses a 4x6 ball array. Signal routing requires at least two PCB layers for clean fanout.