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Infineon Technologies S25FL256LAGBHB023 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL256LAGBHB023 NOR Flash, 256 Mbit, 133 MHz, AEC-Q100

MPNS25FL256LAGBHB023
Active

Infineon S25FL256LAGBHB023, Automotive AEC-Q100 FL-L series, 256 Mbit NOR Flash, SPI Quad I/O / QPI, 133 MHz clock, 2.7 V to 3.6 V supply, -40°C to 85°C, 24-TBGA package.

$6.3525Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL256LAGBHB023 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-L
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case24-TBGA
Memory organization32M x 8

Product details

256 Mbit NOR Flash for automotive firmware and calibration storage

It stores firmware, calibration maps, and event logs in engine control units, transmission controllers, and advanced driver-assistance systems where non-volatile code storage must survive power loss and field updates. Organized as 32 M x 8 bits, the part communicates over a Quad SPI (SPI - Quad I/O) interface with QPI support, achieving a 133 MHz clock rate. That translates to a sustained read throughput that can boot a modern MCU in under a second and handle over-the-air firmware updates without stalling the application processor.

The S25FL256LAGBHB023 carries an EOL-hot lifecycle stage, meaning the manufacturer has issued an end-of-life notice and the part is in its last-time-buy window. Procurement teams should secure final orders and plan for a pin-compatible replacement or a second-source qualification before the buy window closes.

Frequently asked questions

What is S25FL256LAGBHB023's listed series on this component line?

The series is Automotive, AEC-Q100, FL-L. This indicates the part is qualified to the AEC-Q100 stress test standard for automotive-grade integrated circuits.

What is S25FL256LAGBHB023's listed package on this component line?

The package is Tape & Reel (TR), and the physical package is a 24-TBGA (24-ball thin ball grid array, 8x6 mm body).