The S25FL164K0XMFBQ13: Page write time is 3 ms typical, which sets the floor for firmware update latency: a full 64 Mbit chip erase followed by page-by-page programming takes several seconds, so field-update strategies should budget for this.
Infineon lists the S25FL164K0XMFBQ13 as Obsolete. No pin-compatible direct replacement from Infineon exists for new designs — a board spin or software migration to a different NOR Flash family is required for production ramps. For existing BOM positions already qualified with this part, the 8-SOIC 5.30 mm footprint and 2.7-3.6V supply rail are the key fit parameters to match when evaluating a replacement. The AEC-Q100 qualification means the replacement must also carry automotive-grade temperature and reliability testing to avoid a full re-qualification cycle.
The surface-mount package is supplied in Tape & Reel, suitable for automated pick-and-place assembly. No special thermal management is needed for the 64 Mbit density at 108 MHz — the package's junction-to-ambient thermal resistance is adequate for the self-heating from the active read current. The Quad SPI interface shares the same four I/O pins as standard SPI, so the PCB layout is backward-compatible with legacy SPI NOR Flash footprints.
