The S25FL164K0XBHB023 is officially obsolete per Infineon's lifecycle record. No last-time-buy window remains open through the manufacturer. For existing BOM lines, this part is sourced through independent distribution — quantities are lot-specific and confirmed at RFQ.
Memory density and interface — what the 64 Mbit buys you
64 Mbit of NOR flash organized as 8M x 8 bits. The SPI Quad I/O interface reads at up to 108 MHz clock frequency, delivering roughly 54 MB/s sustained throughput in quad-read mode — enough for code shadowing or parameter storage in an automotive ECU that boots from serial flash. The 3 ms page write time (word/page) sets the firmware-update floor — a 64 KB sector rewrite takes roughly 1.5 seconds at the page level.
Automotive qualification and temperature grade
This places it in the engine-bay or transmission-control temperature band — the 105°C ceiling gives margin over the 85°C typical under-hood ambient on a hot day. The FL1-K series designation indicates the automotive-specific screening and reliability testing per AEC-Q100.
Package and board-level fit
24-ball TBGA (8 mm x 6 mm body) — the 0.80 mm ball pitch demands a 4-layer PCB for fan-out; two-layer boards will struggle to route the SPI signals and decoupling vias. The -40°C to 105°C rating means the package's coefficient of thermal expansion (CTE) mismatch with the PCB must be managed with a solder mask-defined pad and a reflow profile that avoids head-in-pillow defects on the BGA balls.