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Infineon Technologies S25FL132K0XBHB020 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL132K0XBHB020 Infineon 32Mbit NOR Flash, Obsolete

MPNS25FL132K0XBHB020
Obsolete

Infineon FL1-K series, 32Mbit NOR flash, SPI Quad I/O, 108 MHz, 2.7-3.6 V, 4M x 8 organization, 24-TBGA (8x6), AEC-Q100 automotive, -40°C to 105°C, S25FL132K0XBHB020.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

S25FL132K0XBHB020 specifications
ParameterValue
SeriesFL1-K
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency108 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 105°C (TA)
GradeAutomotive
PackageTray
TechnologyFLASH - NOR
Memory size32Mbit
Memory formatFLASH
QualificationAEC-Q100
Case24-TBGA
Memory organization4M x 8
Write cycle time - word, page3ms

Product details

32Mbit NOR flash at 108 MHz — SPI Quad I/O for automotive

The S25FL132K0XBHB020 is a 32Mbit NOR flash from Infineon's FL1-K series, organized as 4M x 8 bits and accessed via a SPI Quad I/O interface running at 108 MHz. The Quad I/O reduces read latency by transferring four bits per clock cycle — at 108 MHz that's 54 MB/s theoretical throughput, enough to shadow-execute code from flash in many automotive MCU designs without a separate RAM footprint for the application image. AEC-Q100 qualification and a -40°C to 105°C operating range place this part in the under-hood and engine-bay temperature band — the flash array retains data through the thermal cycles of an automotive ignition-off to full-load drive cycle.

No official successor or pin-compatible replacement is recorded from the original manufacturer. For existing BOM positions that require this exact order code, supply is available through independent distribution — quantities are lot-specific and confirmed at RFQ. The 24-TBGA footprint (8x6 mm) is not shared by the active FL1-K siblings in different packages, so a board spin would be needed to migrate to a current-production part.

Package and board-fit — 24-TBGA 8x6 mm

The 24-ball TBGA package measures 8x6 mm with a 0.80 mm ball pitch typical of this density. The surface-mount footprint requires a solder-paste stencil aperture matched to the ball diameter for reliable reflow — the BGA's corner balls are the alignment fiducials during pick-and-place. No exposed thermal pad; the package's junction-to-board thermal path relies on the outermost balls and the PCB copper plane beneath the die shadow.

Frequently asked questions

What is the closest pin-compatible alternative to S25FL132K0XBHB020 in this memory family?

No pin-compatible alternative is recorded from Infineon for the 24-TBGA package variant. The FL1-K series includes active parts in different packages (SOIC-8, WSON-8) with the same 32Mbit density and SPI Quad I/O interface, but the ball map differs — a board layout change is required.

What compliance documentation does Infineon provide for S25FL132K0XBHB020?

The part carries AEC-Q100 automotive qualification. Standard Infineon documentation includes the datasheet with full timing parameters, the qualification report, and RoHS/REACH compliance declarations available through the manufacturer's document portal.