128 Mbit NOR Flash in a 24-ball BGA — what this part is
It communicates over a Quad I/O SPI interface at up to 104 MHz, giving read throughput suitable for code shadowing or execute-in-place in embedded systems. It comes in a 24-ball BGA package (8x6 mm body), surface-mount only.
Quad-SPI at 104 MHz — read performance for the bus
The page program time is 3 ms typical, and the word program time is 5 µs, which matters when sizing the write buffer in the application layer. At this speed, signal integrity on the BGA layout matters — keep the SPI traces short and matched, and place the decoupling caps close to the supply balls.
Cypress has discontinued the S25FL129P0XBHI203, so it is no longer available through the franchised channel for new production. The last-time-buy window has closed. For existing designs that already qualify this footprint and interface, the remaining stock in independent distribution is the only source. Any new design-in should target the replacement or an alternative part.
24-ball BGA — layout and rework considerations
There is no exposed thermal pad — all heat dissipation is through the solder balls and the PCB copper. The industrial temperature rating means it is qualified for environments like outdoor telecom cabinets, factory floor controllers, and automotive body electronics (non-safety-rated domains).