It speaks SPI with Quad I/O, so it can shift four bits per clock instead of one — that 133 MHz clock frequency translates to a real read throughput around 66 MB/s in Quad I/O fast-read mode, enough to feed an MCU with execute-in-place (XIP) or store a bootloader plus a compressed firmware image. The part comes in an 8-WDFN exposed-pad package (Cypress calls it 8-WSON, 6x8 mm body). Hand-rework is feasible with a hot-air station if you preheat the board; the pad is large enough to get a good solder joint without tombstoning.
Package and rework — 8-WSON exposed pad
The 8-WSON package has a centre thermal pad that must be soldered to the PCB ground plane. Without that connection, thermal resistance climbs and the part may throttle or fail at high temperature. The pad is exposed on the bottom — a stencil aperture around 50–60 % of the pad area keeps solder voiding under control.