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Infineon Technologies S25FL128SAGMFM003 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL128SAGMFM003 NOR Flash, 128Mbit, SPI Quad I/O

MPNS25FL128SAGMFM003
End of Life

Infineon Technologies FL-S series, Automotive AEC-Q100 NOR flash, S25FL128SAGMFM003, 128 Mbit, SPI Quad I/O, 133 MHz, 2.7-3.6 V, -40 to 125 °C, 16-SOIC wide-body, Tape & Reel.

$6.2300Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL128SAGMFM003 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-S
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C~125°C(TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size128Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization16M x 8

Product details

Active production — AEC-Q100 Grade 1 qualified

The S25FL128SAGMFM003: AEC-Q100 Grade 1 qualification means the device is characterized and reliability-tested across the full -40 to 125 °C ambient range — the temperature band that covers underhood and engine-compartment ECUs. An OEM auditor reviewing PPAP documentation will find the grade-1 temperature classification on the qualification report.

128 Mbit density, 133 MHz SPI Quad I/O

Organized as 16 M x 8 bits, the 128 Mbit density is sized for code shadowing or data logging in automotive gateways, ADAS domain controllers, and telematic control units — enough for a full application image plus a small file system. The SPI Quad I/O interface clocks at 133 MHz, delivering a read throughput of 532 Mbit/s in quad mode — fast enough to support XiP (execute-in-place) from the NOR flash without a separate DRAM cache for boot code. The wide-body 16-SOIC (0.295-inch body width) footprint is a common JEDEC outline — no special land pattern or via-in-pad is required, and the package is reflow-compatible with standard lead-free profiles.

The part is delivered in tape-and-reel packaging, suitable for automated pick-and-place assembly. The FL-S series is Infineon's own core product line — if a BOM hedge is required, a functional equivalent from the same family would require a different order code and qualification re-run.