24-BGA package — board layout and rework considerations
The S25FL128SAGBHV200 comes in a 24-ball BGA (8x6 mm body). That is a fine-pitch BGA — not something you swap in the field with a soldering iron. The 24-BGA footprint requires a multi-layer PCB with microvias or at least a four-layer board to route the balls out. For prototyping or low-volume production, the SOIC-16 wide-body variant (S25FL128SAGMFV010) is a more hand-assembly-friendly option. But if your design is already committed to BGA for density or routing reasons, this package saves board area over the SOIC.
This is an active, production-grade NOR flash from a major manufacturer. We source it through independent distribution channels and can quote it to order against an RFQ.