This is a surface-mount part in a 24-ball TBGA package (6x8 mm body). Quad-SPI NOR flash like this is commonly used for code shadowing, firmware storage, and data logging in embedded systems — think industrial controllers, networking gear, and IoT edge nodes where a moderate-density, fast-read non-volatile memory is needed.
This part is officially marked as Obsolete. That means Infineon has ended production; there is no last-time-buy window remaining through the factory channel.
108 MHz Quad-SPI — what the clock rate buys you
That is enough to support execute-in-place (XIP) from flash for many Cortex-M class MCUs without stalling the core on instruction fetches. The 3 ms page write time is typical for this NOR generation — fine for firmware updates, not for high-frequency data logging. If your application needs faster writes or higher density, you would be looking at a different family entirely.
24-ball BGA — footprint and rework notes
The 24-ball TBGA (6x8 mm) is a fine-pitch BGA — not a hand-solderable package. Reballing or replacement calls for a hot-air rework station with a profile matched to the solder ball alloy.