64 Mbit NOR Flash for code-shadowing and data logging
The S25FL064LABNFI010: It provides the read throughput and random-access latency that microcontrollers need for execute-in-place (XIP) code shadowing or high-reliability firmware storage. With a 108 MHz clock rate and Quad I/O SPI interface, the part delivers sustained read bandwidth well above single-bit SPI, reducing firmware boot time and enabling faster over-the-air update windows.
Supply voltage and temperature envelope
The 8-WSON (5x6) package with exposed pad requires a thermal-land pattern on the PCB to pull heat into the ground plane. The pad is electrically connected to the substrate; the layout must tie it to the same potential as the VSS pin to avoid latch-up risk.
RoHS status and assembly planning
The S25FL064LABNFI010 is marked RoHS non-compliant. This typically indicates the die-attach or lead finish contains lead (Pb) above the 0.1% threshold, often for high-reliability or extended-temperature applications. For lead-free assembly lines, verify the exemption category (e.g., RoHS exemption 7c-I for high-melt-temperature solder) or evaluate the RoHS-compliant variant S25FL064LABNFV010.