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Infineon Technologies S25FL064LABMFN010 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL064LABMFN010 64Mbit NOR Flash, 108 MHz SPI

MPNS25FL064LABMFN010
Active

Infineon FL-L series S25FL064LABMFN010, 64Mbit NOR Flash, SPI - Quad I/O, QPI interface, 108 MHz clock, 2.7V-3.6V supply, -40°C to 125°C, 8-SOIC package, Tray.

$3.3000Ref. price · indicative, final on quote
Packaging8-SOIC (0.209", 5.30mm Width)
RoHSROHS3 Compliant
SeriesFL-L
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL064LABMFN010 specifications
ParameterValue
SeriesFL-L
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency108 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C ~ 125°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size64Mbit
Memory formatFLASH
Case8-SOIC (0.209\", 5.30mm Width)
Memory organization8M x 8

Product details

64 Mbit NOR Flash with 108 MHz Quad-SPI — fit for industrial and automotive storage

The memory is non-volatile and built on NOR Flash technology, making it suitable for code shadowing, parameter storage, and firmware updates in embedded systems.

108 MHz clock and Quad I/O — read throughput for execute-in-place

For a firmware engineer bringing up a board, the Quad-SPI interface at this clock rate means the CPU can fetch instructions directly from the Flash with minimal wait states, provided the host controller's Quad-SPI peripheral is configured for the correct dummy cycles and drive strength. The 64 Mbit density (8 MB) is a common size for storing a full firmware image plus an OTA staging area in connected MCU designs.

Package and mounting — 8-SOIC wide-body

The 8-SOIC wide-body package (5.30 mm body width) is surface-mount, fitting standard SOIC-8 footprints.

It is ROHS3 compliant.

Frequently asked questions

What is the difference between S25FL064LABMFN010 and S25FL064LABMFI010?

Both are 64 Mbit FL-L NOR Flash with the same 108 MHz Quad-SPI interface and 8-SOIC package. Choose the MFN010 when the operating environment exceeds 85°C, such as under-hood automotive or industrial enclosures near heat sources.