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Infineon Technologies S25FL064LABMFA003 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL064LABMFA003 Infineon 64Mbit NOR Flash, 108MHz SPI

MPNS25FL064LABMFA003
Active

Infineon Technologies FL-L Automotive series, 64Mbit NOR Flash, SPI Quad I/O, 108 MHz, 2.7-3.6V, -40 to 85°C, 16-SOIC, Tape & Reel.

$2.0694Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

S25FL064LABMFA003 specifications
ParameterValue
SeriesAutomotive, AEC-Q100, FL-L
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency108 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR)
TechnologyFLASH - NOR
Memory size64Mbit
Memory formatFLASH
Case16-SOIC (0.295\", 7.50mm Width)
Memory organization8M x 8

Product details

Active lifecycle — no BOM risk from obsolescence

The S25FL064LABMFA003: No end-of-life notice or last-time-buy window is in effect, so this part can be specified into new designs and sustained across production runs without a forced migration.

64 Mbit NOR Flash with 108 MHz quad-SPI throughput

This is a 64 Mbit (8M x 8) NOR Flash memory organized for code shadowing, parameter storage, and data logging in embedded systems. The SPI interface supports Quad I/O and QPI protocols at a clock frequency up to 108 MHz, delivering a sustained read throughput that keeps a Cortex-M or similar MCU fed without wait-state bottlenecks during execute-in-place (XIP) operation. The 64 Mbit density holds a compressed firmware image of roughly 6-8 MB, leaving headroom for a dual-bank update scheme with a fallback image.

AEC-Q100 qualification and industrial temperature range

This covers engine-bay electronics, transmission control units, and chassis-domain ECUs that see under-hood thermal profiles without the extended -40 to +125°C range of Grade 1 parts. For industrial applications, the same temperature grade suits outdoor telecom enclosures, solar inverters, and factory-floor PLCs where the ambient stays below 85°C. The 16-SOIC wide-body package (7.50 mm body width) is a standard reflow footprint with good thermal dissipation through the leads — no special pad design beyond the JEDEC land pattern.

Supply posture and ordering

The Tape & Reel packaging supports automated assembly without manual tube handling.

Frequently asked questions

What is the memory interface and maximum clock speed?

This provides a fast read throughput for code shadowing or execute-in-place applications.