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Infineon Technologies S25FL064LABBHN020 — Memory (DRAM / SRAM / Flash / EEPROM)

S25FL064LABBHN020 64Mbit NOR Flash, 108 MHz SPI

MPNS25FL064LABBHN020
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Cypress FL-L series S25FL064LABBHN020, 64Mbit NOR Flash memory, SPI Quad I/O and QPI interface, 108 MHz clock, 2.7V–3.6V supply, -40°C to 125°C industrial temperature range, 24-ball BGA (8x6 mm) package, Tray.

$2.2540Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

S25FL064LABBHN020 Technical Specifications
ParameterValue
SeriesFL-L
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage2.7V ~ 3.6V
Frequency108 MHz
Memory interfaceSPI - Quad I/O, QPI
Operating temperature-40°C ~ 125°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size64Mbit
Memory formatFLASH
Case24-TBGA
Memory organization8M x 8

Product details

What this 64 Mbit NOR Flash brings to the board

It talks over a SPI Quad I/O and QPI interface at up to 108 MHz — fast enough to support execute-in-place (XIP) for a bootloader or a small RTOS kernel without dragging down the bus.

108 MHz Quad-SPI — what that clock buys you

At 108 MHz the Quad-SPI interface can deliver sustained read throughput north of 50 MB/s in quad-output mode. That is enough to stream a compressed firmware image from Flash into RAM for OTA updates without stalling the application. The QPI mode reduces the command overhead to a single byte, which tightens the latency on random reads — useful when the MCU is fetching scattered lookup tables or calibration constants.

Industrial temperature range and the 24-BGA footprint

The 24-ball BGA (8x6 mm body) keeps the PCB footprint small — about the area of an SOIC-8 — but the hidden balls mean you need X-ray inspection after reflow. The BGA is MSL 3 out of the bag; if the moisture barrier pouch has been open longer than the floor-life window, bake the parts at 125°C for 48 hours before reflow to avoid popcorning. A 0.8 mm ball pitch leaves room for a single via between balls on a 4-layer board, but keep the decoupling caps within 3 mm of the VDD balls.

The FL-L series is a mature, broadly second-sourced NOR Flash family, so supply risk is low.

Frequently asked questions

What is the difference between S25FL064LABBHN020 and S25FL064LABBHN023?

The two order codes differ only in the shipping medium: the S25FL064LABBHN020 ships in Tray format, while the S25FL064LABBHN023 ships in Tape & Reel. The die, package, and electrical specs are identical.