64 Mbit SPI NOR flash with Quad I/O
The S25FL064LABBHB033: The Quad I/O bus effectively quadruples the read throughput over a standard SPI interface — useful for fast firmware shadowing or execute-in-place (XIP) code storage in an automotive ECU.
AEC-Q100 qualification and temperature grade
The part is qualified to AEC-Q100, the automotive IC stress-test standard. The 105°C ceiling leaves margin above the 85°C typical cabin limit, but a powertrain module seeing 125°C ambient would need a higher-grade device.
24-ball TBGA — footprint and rework
Housed in a 24-ball thin BGA (TBGA) with a 6 mm x 8 mm body. The ball pitch is 0.80 mm — a 4-layer PCB with via-in-pad or microvia fan-out is typical for this footprint. The BGA requires a controlled reflow profile per J-STD-020; moisture sensitivity level (MSL) should be confirmed from the lot date code before rework.