The IRLU3110ZPBF HEXFET N-channel MOSFET has a gate charge of 48 nC at 4.5 V and input capacitance of 3980 pF at 25 V.
Through-hole IPAK — board-level fit and thermal path
The IPAK (TO-251AA) package has short leads and a through-hole mounting style. It fits into the same PCB footprint as a TO-252 DPAK surface-mount part with a different hole pattern, but the through-hole tab solders into the board and conducts heat to the copper plane. The 140 W maximum power dissipation at case temperature assumes the drain tab is soldered to a sufficient thermal mass.
ROHS3 compliant per the listing.
