IRLU024NPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET® N-Channel MOSFET, IRLU024NPBF, 55 V Vdss, 17 A Id, 65 mOhm Rds(on) at 10 V, TO-251AA IPAK, -55°C to 175°C.

Infineon Technologies IRLU024NPBF
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[IN STOCK] In Stock: 3,224 pcs
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Technical specifications

IRLU024NPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingThrough Hole
Drain to source voltage55 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C17A (Tc)
Power dissipation45W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±16V
TechnologyMOSFET (Metal Oxide)
CaseTO-251-3 Short Leads, IPak, TO-251AA
Vgs(th) (Max) @ id2V @ 250µA
Rds on (Max) @ id, vgs65mOhm @ 10A, 10V
Gate charge (Qg) (Max) @ vgs15 nC @ 5 V
Input capacitance (Ciss) (Max) @ vds480 pF @ 25 V

Technical details

55 V, 17 A N-channel HEXFET in a TO-251AA IPAK

Switching and drive characteristics for BOM planning

Total gate charge is 15 nC at a 5 V gate-source voltage, low enough that a standard 5 V logic output can drive the gate directly in moderate-frequency switching applications, eliminating a dedicated gate-driver IC. Input capacitance (Ciss) is 480 pF typical at 25 V drain-source bias, which together with the gate charge sets the switching energy per cycle for the upstream driver. Maximum power dissipation is 45 W at 25 °C case temperature; derate above that per the datasheet's thermal impedance curve.

Through-hole IPAK package and temperature grade

The IPAK footprint is more compact than a standard TO-220 and suits high-vibration environments where a surface-mount package would risk solder-joint fatigue. The maximum gate-source voltage is ±16 V, allowing the part to tolerate 15 V gate-drive rails common in industrial power stages.

No stock-holding claim; quoted per BOM quantity.

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