Temperature grade and environment
Junction temperature range spans -55°C to 175°C. The 140 W maximum power dissipation at case temperature is the thermal budget.
Package and mounting
Surface-mount DPAK (TO-252) with two leads plus the tab. The tab is the drain connection and the primary thermal path — solder the tab to a wide copper pour on the PCB. The supplier device package is D-Pak, same footprint.
Lifecycle and compliance
No end-of-life notice or last-time-buy window is in effect. The part carries the HEXFET series designation from Infineon.
