IRLR3410TRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET N-Channel MOSFET, IRLR3410TRPBF, 100 V Vdss, 17 A Id, 105 mOhm Rds(on) at 10 V, DPAK (TO-252) surface mount, -55°C to 175°C junction temperature.

Infineon Technologies IRLR3410TRPBF
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRLR3410TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C17A (Tc)
Power dissipation79W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±16V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id2V @ 250µA
Rds on (Max) @ id, vgs105mOhm @ 10A, 10V
Gate charge (Qg) (Max) @ vgs34 nC @ 5 V
Input capacitance (Ciss) (Max) @ vds800 pF @ 25 V

Technical details

100 V logic-level HEXFET in a DPAK footprint

Gate drive and switching behaviour

This MOSFET is characterised for gate drive voltages of 4 V and 10 V, with the 10 V drive delivering the rated Rds(on). The maximum gate threshold voltage is 2 V at 250 µA drain current, so a 3.3 V logic output from a microcontroller or gate-driver IC will reliably turn the device on — but the on-resistance will be higher than the 105 mOhm spec because the Rds(on) is quoted at 10 V. Total gate charge is 34 nC at 5 V gate-source; driving this gate at 100 kHz draws roughly 3.4 mA from the driver, well within the capability of a standard MOSFET driver. Input capacitance is 800 pF at 25 V drain-source, which sets the switching energy per cycle in a hard-switched topology.

No official second-source cross-reference is published in the Infineon documentation, but the HEXFET series has broad pin-compatible equivalents from other manufacturers — verify the gate charge and threshold voltage against your driver circuit before substituting.

IRLR3410TRPBF
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