IRLR2703TRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET® N-Channel MOSFET, IRLR2703TRPBF, 30 V Vdss, 23 A Id, 45 mOhm Rds(on) at 14 A, 10 V, DPAK (TO-252-3), -55°C to 175°C.

Infineon Technologies IRLR2703TRPBF
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRLR2703TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C23A (Tc)
Power dissipation45W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±16V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id1V @ 250µA
Rds on (Max) @ id, vgs45mOhm @ 14A, 10V
Gate charge (Qg) (Max) @ vgs15 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds450 pF @ 25 V

Technical details

HEXFET N-channel in DPAK — 30 V, 23 A, 45 mOhm

The DPAK footprint with an exposed tab allows the PCB copper to pull heat away; the 45 W power dissipation ceiling (at Tc=25°C) sets the thermal budget for continuous conduction.

Gate charge totals 15 nC at 4.5 V, which means a 5 V logic-level output or a low-current gate driver can switch the FET without a dedicated boost stage. The drive voltage range (4 V to 10 V for rated Rds(on)) matches 5 V microcontroller outputs directly. At 4 V gate drive the on-resistance rises slightly from the 45 mOhm figure at 10 V, but the part is specified to deliver the full 23 A drain current with the lower drive voltage.

Thermal and environmental range

This makes the IRLR2703TRPBF suitable for under-hood automotive compartments, high-ambient enclosures, or any design where the junction may spike above 150°C during fault conditions.

IRLR2703TRPBF
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