IRLR120NTRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET® IRLR120NTRPBF, N-Channel MOSFET, 100 V Vdss, 10 A Id, 185 mOhm Rds(on) at 10 V, D-Pak (TO-252) surface mount, -55°C to 175°C.

Infineon Technologies IRLR120NTRPBF
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRLR120NTRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C10A (Tc)
Power dissipation48W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±16V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id2V @ 250µA
Rds on (Max) @ id, vgs185mOhm @ 6A, 10V
Gate charge (Qg) (Max) @ vgs20 nC @ 5 V
Input capacitance (Ciss) (Max) @ vds440 pF @ 25 V

Technical details

100 V N-channel HEXFET in a rework-friendly DPAK

Rds(on) is specified at 185 mOhm maximum with 10 V on the gate and 6 A drain current. The 2 V maximum threshold at 250 µA means the device starts conducting early, but full enhancement requires the higher drive voltage to minimise conduction loss. Gate charge is 20 nC at 5 V — a modest figure that keeps switching losses low in the 10–50 kHz range. The 440 pF input capacitance at 25 V drain bias gives the driver a clear capacitive load to push; a 1 A gate driver charges the gate in about 20 ns, so rise-time-limited switching above 100 kHz is not the target application for this part.

It is ROHS3 compliant and available through independent distribution.

IRLR120NTRPBF
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