IRLML2030TRPBF

Infineon Technologies · HEXFET® Series

Infineon HEXFET® N-Channel MOSFET, IRLML2030TRPBF, 30 V Vdss, 2.7 A continuous drain, 100 mOhm Rds(on) at 10 V, SOT-23-3 package, -55 to 150 °C junction.

Infineon Technologies IRLML2030TRPBF
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRLML2030TRPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C2.7A (Ta)
Power dissipation1.3W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-236-3, SC-59, SOT-23-3
Vgs(th) (Max) @ id2.3V @ 25µA
Rds on (Max) @ id, vgs100mOhm @ 2.7A, 10V
Gate charge (Qg) (Max) @ vgs1 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds110 pF @ 15 V

Technical details

SOT-23 N-channel for low-side switching

The Infineon IRLML2030TRPBF is a 30 V, 2.7 A N-channel HEXFET MOSFET in a three-lead SOT-23-3 package.

Gate drive and switching — 1 nC total charge

Total gate charge is 1 nC at 4.5 V, and the drive voltage range spans 4.5 V to 10 V for minimum on-resistance. Input capacitance is 110 pF at 15 V drain-source, so the gate rise time with a 10 Ω drive resistor is roughly 1 ns — fast enough for most low-side PWM applications, but the loop inductance in a SOT-23 layout must be kept short to avoid ringing.

Temperature range and power dissipation

The practical limit is the 1.3 W power dissipation at 25 °C ambient in still air — derate above 25 °C per the datasheet curve. For continuous 2.7 A load, the duty cycle must be low or the board copper area must sink the heat.

It is ROHS3 compliant.

IRLML2030TRPBF
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