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Infineon Technologies IRL2910STRLPBF

IRL2910STRLPBF N-Channel MOSFET, 100 V, 55 A, D2PAK

MPNIRL2910STRLPBF
End of Life

IRL2910STRLPBF, HEXFET series, N-Channel MOSFET, 100 V Vdss, 55 A Id, 26 mOhm Rds(on) at 10 V, D2PAK surface mount, -55°C to 175°C.

$3.26Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRL2910STRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage100 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C55A (Tc)
Power dissipation3.8W (Ta), 200W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±16V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id2V @ 250µA
Rds on (Max) @ id, vgs26mOhm @ 29A, 10V
Gate charge (Qg) (Max) @ vgs140 nC @ 5 V
Input capacitance (Ciss) (Max) @ vds3700 pF @ 25 V

Product details

Gate drive and switching considerations

The gate charge is 140 nC at 5 V, which sets the driver energy per switching cycle. For a 100 kHz switching frequency, the average gate drive current is 14 mA, well within the capability of most dedicated MOSFET gate drivers. The input capacitance is 3700 pF at 25 V drain-source, which together with the gate resistance determines the switching speed and turn-on/turn-off delay. The maximum gate-source voltage is ±16 V, so a 10 V or 12 V gate drive rail is safe, but a 15 V rail would exceed the rating.

Package and thermal path

Housed in a D2PAK (TO-263-3) surface-mount package with a large exposed drain tab. The tab is the thermal path to the board — a copper pour on the top and bottom layers with vias is needed to keep junction temperature below 175°C at full load. The package reworks cleanly with hot air if the board has adequate copper soak. Power dissipation is rated at 3.8 W in still air at 25°C ambient, and 200 W when the case is held at 25°C — the real limit in a design is the board's ability to sink heat.

Frequently asked questions

Is IRL2910STRLPBF equivalent to IRL2910PBF?

The IRL2910STRLPBF and IRL2910PBF share the same die and ratings — the suffix difference indicates the packaging and reel format. The STRLPBF variant ships in Tape & Reel for automated assembly, while the PBF variant typically comes in tube or bulk.