Ratings that shape the BOM decision
The 5.1 mOhm Rds(on) at 65 A and 10 V is within the 160 W package limit at case temperature. The 130 nC gate charge at 10 V allows switching in the tens of kilohertz range.
Package and mounting reality
Housed in a TO-263-3 (D2PAK) surface-mount package, the IRFS7540TRLPBF has a large exposed drain tab that must be soldered to a copper area for thermal management. The tab is the drain — no isolation, so the heatsink plane carries the full 60 V rail. The part ships on tape and reel, which is the standard for automated pick-and-place; cut tape is also available for prototype runs. Orientation is unambiguous: the tab is the drain, the gate and source pins are clearly marked on the package body.
Lifecycle and sourcing posture
The IRFS7540TRLPBF carries an Active product status per Infineon's lifecycle records. It is ROHS3 compliant, so it passes the material restrictions for EU and most global markets without exemptions. For BOM planning, this means no last-time-buy risk in the near term, and the part can be specified into new designs with confidence that supply will hold through the production run.