IRFS7434TRLPBF

Infineon Technologies · HEXFET®, StrongIRFET™ Series

Infineon IRFS7434TRLPBF, HEXFET® StrongIRFET™ series, N-channel MOSFET, 40 V Vdss, 195 A Id, 1.6 mOhm Rds(on) at 10 V, 324 nC Qg, D2PAK (TO-263) surface mount, -55 to 175 °C.

Infineon Technologies IRFS7434TRLPBF
Download datasheet (PDF)
[IN STOCK] In Stock: 49 pcs
$3.04/ pc

Volume pricing

Buy Now

MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

IRFS7434TRLPBF specifications
Parameter / AttributeSpecification / Value
SeriesHEXFET®, StrongIRFET™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage40 V
Drive voltage (Max rds on, min rds on)6V, 10V
Current - continuous drain (Id) @ 25°C195A (Tc)
Power dissipation294W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id3.9V @ 250µA
Rds on (Max) @ id, vgs1.6mOhm @ 100A, 10V
Gate charge (Qg) (Max) @ vgs324 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds10820 pF @ 25 V

Technical details

324 nC gate charge — the driver budget for switching frequency

To switch this FET in 100 ns, the gate driver must source over 3 A peak. The input capacitance of 10820 pF at 25 V drain-source reinforces the same message: this is a large-die part designed for low-frequency hard switching (up to maybe 50–100 kHz) or for synchronous rectification where the FET is on most of the cycle. A small SOT-23 gate driver will struggle; plan for a dedicated driver with at least 4 A peak source-sink capability.

175 °C junction — military-temperature silicon in a D2PAK

The 175 °C Tj max is unusual for a 40 V trench MOSFET — most competitors stop at 150 °C. This part can live in an engine bay, a hot-swap supply, or a telecom rectifier where the ambient near the FET hits 125 °C.

No last-time-buy window to track, no successor to qualify. The part is ROHS3 compliant.

IRFS7434TRLPBF
[ALLOC] verified
Quote