The 5.8 mOhm maximum Rds(on) at 75 A, 10 V gate drive sets the conduction loss floor for a high-current switching node — at 75 A the on-state dissipation is roughly 33 W, which the 230 W package limit can handle with adequate heatsinking.
Package and mounting — D2PAK footprint decisions
The IRFS3307ZTRRPBF comes in a D²PAK (TO-263-3) surface-mount package with the drain tab as the large exposed pad. For a 120 A continuous drain current, the PCB copper pour area and the number of thermal vias under the tab determine the real-world RthJA — the package alone can handle 230 W at case temperature, but that assumes the board can pull the heat away. The ±20 V maximum gate-source voltage is standard for logic-level gate drive circuits; the 10 V drive voltage for minimum Rds(on) means a 12 V rail or a dedicated gate-driver supply is needed to hit the 5.8 mOhm floor.
The ROHS3 compliance is confirmed.