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Infineon Technologies IRFS3207TRLPBF

IRFS3207TRLPBF HEXFET N-Ch MOSFET, 75V 170A D2PAK

MPNIRFS3207TRLPBF
End of Life

Infineon HEXFET® IRFS3207TRLPBF, N-Channel MOSFET, 75 V Vdss, 170 A Id, 4.5 mOhm Rds(on) at 75 A, 10 V, D2PAK (TO-263) surface mount, -55°C to 175°C junction.

$3.74Ref. price · indicative, final on quote
PackagingTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

IRFS3207TRLPBF Technical Specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage75 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C170A (Tc)
Power dissipation300W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs4.5mOhm @ 75A, 10V
Gate charge (Qg) (Max) @ vgs260 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds7600 pF @ 50 V

Product details

75 V, 170 A N-channel HEXFET in D2PAK

The Infineon IRFS3207TRLPBF is a 75 V, 170 A N-channel MOSFET from the HEXFET series, housed in a surface-mount D2PAK (TO-263) package. It is designed for high-current switching applications where low on-resistance and high junction temperature tolerance are required. The 4.5 mOhm max Rds(on) at 75 A and 10 V drive keeps conduction losses low in high-current paths like DC-DC converters, motor drives, and battery management systems. The 170 A continuous drain current rating at 25 °C case temperature gives headroom for pulsed or heavy-load designs, though the actual current in a real board depends on the heatsinking and ambient temperature.

Gate charge and switching speed

The total gate charge is 260 nC at 10 V. The 7600 pF input capacitance at 50 V drain-source factors into the drive circuit design. The drive voltage for achieving the specified Rds(on) is 10 V. The maximum gate-source voltage is ±20 V.

Temperature range and thermal management

The 300 W power dissipation at the case is a theoretical maximum — the real thermal limit depends on the PCB copper area and any attached heatsink. The D2PAK's exposed tab is the primary thermal path; a good solder joint to a large copper pour is essential.

Lifecycle and compliance

Cut Tape quantities are also available for prototyping or low-volume builds.

Frequently asked questions

Does IRFS3207TRLPBF require a heatsink?

At 170 A continuous drain current the 4.5 mOhm Rds(on) produces about 130 W of conduction loss — that requires a substantial heatsink or a large copper area on the PCB to keep the junction below 175°C.

Is IRFS3207TRLPBF RoHS compliant?

Yes, the IRFS3207TRLPBF is ROHS3 compliant, suitable for lead-free soldering processes.